路透首尔3月18日 - 三星电子 005930.KS 与AMDAMD.O 周三宣布，双方已签署备忘录(MOU)，旨在扩大双方在人工智能$(AI)$基础设施内存芯片供应方面的战略合作。双方在声明中表示，该协议将重点为AMD即将推出的Instinct MI455X人工智能加速器供应三星的下一代高带宽内存HBM4，并为AMD第六代EPYC处理器提供优化版的DDR5内存。双方还将探讨代工合作的可能性，届时三星或将为AMD的下一代产品提供芯片代工服务。根据协议，三星将成为AMD下一代AI GPU的关键HBM4供应商。这家韩国公司此前已是AMD的主要HBM供应商，曾为AMD的MI350X和MI355X加速器提供HBM3E芯片。该协议签署时点正值Nvidia召开年度开发者大会GTC期间。Nvidia首席执行官黄仁勋周一在大会上宣布与这家韩国公司的代工合作，并盛赞其HBM4芯片。(完)
(编审 张明钧)
((jeremy.chang@thomsonreuters.com; +886-2-87297935))
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