IT之家 3 月 20 日消息，FPGA 企业 QuickLogic 美国加州当地时间本月 17 日宣布，已获得一份价值数十万美元的合同，为客户一款基于 Intel 18A 工艺制程的 ASIC 芯片提供其增强型嵌入式 FPGA (eFPGA) 硬化 IP。此新一代 IP 相较以前产品实现了 PPA（IT之家注：功耗、性能、面积）上的改进。
QuickLogic IP 销售副总裁 Andy Jaros 表示：
QuickLogic 致力于与主要客户紧密合作，共同识别并实施对双方成功至关重要的改进措施。
凭借我们在 2025 年合同框架下开发的显著 PPA 改进，QuickLogic 已做好充分准备，能够满足 ASIC 和 SoC 中超高密度 eFPGA 内核的需求，以及大型分立 FPGA 的需求。我们相信，这加上我们应对成本敏感型应用能力的提升，将显著拓宽我们所能覆盖的市场范围和应用场景。
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