特斯拉CEO马斯克上周日宣布启动Terafab芯片制造计划，预计投资200亿至250亿美元。与此同时，特斯拉也在官网上招募半导体人才，此次招募的流程整合工程师并非一般工程职位，该职务将主导先进逻辑系统单芯片(SoC)开发，涵盖从新产品导入、量产良率提升、制程窗口分析、制程优化、WAT测试、可靠性预测，到产品认证与DPPM降低的完整流程。应征者需具备学士以上学历，并拥有至少十年以上先进制程开发经验，涵盖良率提升、代工厂合作与供应链管理能力。技术能力方面，应征者需熟悉鳍式场效晶体管(FinFET)、环绕式闸极(GAA)与晶背供电(BSPDN)等先进节点技术，并涵盖FEOL、MOL、BEOL全段制程。业界指出，上述条件几乎直接看齐目前在台积电、先进封装与大型IC设计公司中负责先进节点量产与良率爬升的关键人才。
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