手机有望跑大模型,全球首颗“二维-硅基混合架构”闪存芯片问世

新京报
12 hours ago

新京报讯(记者张璐)3月25日,2026中关村论坛年会开幕式暨全体会议举行,2025年度“中国科学十大进展”在开幕式上发布,全功能二维半导体/硅基混合架构异质集成闪存芯片入选,其性能“碾压”目前的Flash闪存技术,比闪存快了100万倍。手机用久了变卡、电脑打开大文件要等半天?这背后,其实是存储芯片的速度拖了后腿。尤其在AI时代,数据量爆炸式增长,传统存储芯片的速度和功耗,已经成为制约算力的“瓶颈...

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