金吾财讯 | 半导体板块开盘后持续走高，台积电(TSM)、英伟达(NVDA)、英特尔(INTL)涨超2%，德州仪器(TXN)涨1.78%，AMD(AMD)涨1.20%。消息面上，根据Counterpoint Research最新发布的晶圆代工市场供应追踪报告，2025年全球晶圆代工2.0市场营收达到3200亿美元，同比增长16%。这一双位数增长主要得益于先进制程制造与先进封装领域对AI GPU和AI专用芯片(ASIC)的稳定需求。以台积电为代表的纯晶圆代工厂引领人工智能驱动的增长势头，而主要封测(OSAT)厂商则从溢出订单中受益。
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