智通财经APP获悉，据港交所4月12日披露，晶晨半导体(上海)股份有限公司(简称：晶晨半导体)再次向港交所主板递交上市申请书，中金公司、海通国际为其联席保荐人。根据弗若斯特沙利文报告，按2024年的相关收入计，该公司在专注于智能终端SoC芯片的厂商中位列全球第四(全球市场份额为1.2%)，在家庭智能终端SoC芯片领域位列中国内地第一、全球第二(全球市场份额为17.7%)。
据招股书，该公司是领先的系统级半导体设计厂商，面向智慧家庭、智慧办公、智慧出行、娱乐教育、工业生产场景，提供卓越的智能终端控制与连接解决方案，包括智能多媒体与显示SoC主控芯片、AIoTSoC主控芯片、通信与连接芯片、智能汽车SoC芯片等，致力于赋能全球智能终端从万物互联走向万物智联。
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