IT之家 4 月 14 日消息，参考韩媒 ETNEWS 稍早前报道，该国 AI 芯片制造商 DEEPX 在今日的新闻发布会上表示，基于三星晶圆代工 2nm 工艺制程的 DX-M2 芯片目标 2027 年实现量产。
DEEPX 称 DX-M2 芯片的目标是以 5W 提供 80 TOPS 的 AI 算力。而其长期愿景是在电池供电的设备上本地运行数百亿到数千亿参数规模的生成式 AI 模型，从而真正开启物理 AI 时代。
▲ DEEPX 现有产品
DEEPX 还同步公布了一项软件战略，旨在简化用户从英伟达平台向其 DXNN 软件堆栈的迁移。在机器人领域，用户可在继续使用 Isaac ROS 机器人操作系统的同时将推理负载转移到 DEEPX 的芯片上来。
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