IT之家 4 月 20 日消息，台媒《电子时报》在本月 17 日的报道中提到，台积电 (TSMC) 的 CoPoS 先进封装目前最快预计 2030 年末量产，相较普遍预计显著延后。
CoPoS 以面板 (Panel) 取代 CoWoS 中的晶圆 (Wafer)，这可实现更大的封装面积，提升生产效率、降低制造成本，然而也面临着均匀与翘曲等亟待解决的问题。
IT之家附上报道整理的台积电 CoPoS 时间线：2026Q3 启动研发 → 2027Q3 下达中试线设备订单 → 2028Q2 中试线设备导入 → 2029Q3 下达量产设备订单 → 2030Q1 量产线设备导入 → 2030Q4 首批量产品完工。
此外，报道还指出台积电将在 2027 年显著提升 SoIC 先进封装工艺的产能，从月均 1 万片迅速提升到月均 5 万片，应对英伟达的大额需求，这其中一成将用于光电合封（也称共封装光学，即 CPO）。
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