地平线发布舱驾融合整车智能体芯片

每日经济新闻
Apr 22

4月22日,在地平线2026年度技术产品发布会上,地平线创始人兼CEO(首席执行官)余凯发布舱驾融合整车智能体芯片“星空Starry 6P”,该芯片采用5nm车规制程,具备650 TOPS算力和273 GB/s带宽。  同日,地平线推出面向智能座舱的车载智能体操作系统“咖咖虾(KaKaClaw)”,支持连续对话、多指令与模糊指令识别,以及自动导航规划等功能,首发搭载于奇瑞iCar V27车型。据悉...

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