4月28日，据台湾工商时报，台积电资深副总经理侯永清于近日表示，为应对AI与高性能计算(HPC)需求爆发，相较过往，台积电正以“二倍速”推进扩产计划，今年将同时有五座2nm晶圆厂进入产能爬坡(ramp-up)阶段，写下历年最积极的扩产纪录。
侯永清分析称，这种一年内多厂同步导入新制程的模式，过去从未出现；体现AI需求已迫使供应链进入“超高速扩张”阶段。受益于此，2nm首年产出将较3nm同期提升约45%，显示产能利用率显著提升。消息称，在需求支撑下，AI芯片出货势头强劲。2022年至2026年间，用于AI加速器的晶圆出货量已大幅成长11倍，其中大尺寸晶粒需求亦同步提升6倍，反映AI运算架构朝向高整合与高效能发展。
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