金吾财讯 | 西门子与台积电(TSMC)近日宣布进一步深化伙伴关系，致力于在半导体设计工作流程中全面推进AI驱动的自动化。此举旨在利用AI技术加速先进工艺节点的开发，并大幅提升芯片设计效率。据悉，本次合作的核心在于引入西门子的Fuse EDA AI系统，结合Calibre和Aprisa工具，实现复杂多步设计任务的自动化，从而显著优化设计规则检查(DRC)与物理验证环节。目前，西门子多款EDA工具已顺利获得台积电最新工艺技术认证，全面支持3nm、2nm以及更先进的A16和A14节点。双方的合作版图还进一步延伸至基于台积电3DFabric平台的3D IC设计验证，以及基于COUPE技术的硅光子领域。业内指出，EDA龙头与晶圆代工巨头将AI深度融入核心芯片设计流程，将直接赋能半导体产业链，有效缩短先进节点芯片的上市时间、提升良率并增强市场核心竞争力。
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