首款3nm中端神U来了!联发科天玑8600史诗级升级:OV米耀集体要用

快科技
May 12

快科技5月12日消息,联发科将在今年下半年推出全新中端芯片天玑8600,这颗芯片基于台积电3nm工艺制程打造,它不仅是联发科首款3nm 8系芯片,也是整个行业第一款正式落地的3nm中端芯片。

据悉,上代SoC天玑8500基于台积电4nm工艺制造,采用的是成熟的N4P节点,CPU搭载第二代全大核架构,由1颗主频3.4GHz的Cortex-A725、3颗主频3.20GHz的Cortex-A725,再加4颗主频2.20GHz的Cortex-A725组成。

官方公开数据显示,天玑8500的多核性能相较前代提升7%,支持的内存带宽提升12%,整机安兔兔跑分超过240万分,上市后就凭借均衡的能效表现受到大量终端厂商的青睐。

时隔不到一年,天玑8600就完成全链路开发即将和消费者见面,这颗芯片不仅升级到了更先进的3nm制程,CPU架构也将同步迎来大幅革新,是联发科史上性能最强的8系芯片。

值得注意的是,目前小米、OPPO、vivo、荣耀及其子品牌都在做天玑8600芯片的前期评估工作,对应的量产终端机型也会在今年年底亮相。

依托3nm工艺带来的能效优势和架构升级的性能提升,天玑8600基本坐稳了中端市场新一代神U的位置,后续将给两千价位段的机型带来远超以往的性能上限。

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