大族数控:下游终端客户的产品有涉及2.5D/3D封装FC-BGA载板、FOPLP等先进封装

中金财经
May 13

  证券之星消息,大族数控(301200)05月13日在投资者关系平台上答复投资者关心的问题。投资者提问:先进封装市场快速增长,请问公司在 FOPLP、2.5D/3D 封装等先进封装领域,有哪些设备和技术布局,目前的产业化进展如何?大族数控回复:尊敬的投资者,您好!公司专注于PCB及先进封装领域的专用加工设备的研发制造,下游终端客户的产品有涉及2.5D/3D封装FC-BGA载板、FOPLP等先进封装;推出的新型激光加工方案、高精度成型方案等获得国内外客户认可及批量订单。谢谢!为证券之星据公开信息整理,由AI算法生成(网信算备310104345710301240019号),不构成投资建议。

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