5月13日，以色列芯片代工企业高塔半导体（Tower Semiconductor）发布最新财务预期。得益于人工智能及数据中心投资热潮拉动相关芯片需求，公司第二季度营收预期超出市场预期，并宣布已签署价值13亿美元的长期芯片供应合同。受此消息提振，公司在美上市股票早盘交易涨幅超过17%。

　　据披露，高塔半导体此次签署的13亿美元大单旨在为人工智能数据中心供应高速数据传输用硅光子芯片，相关收入预计将于2027年兑现。为锁定产能，相关客户已向高塔半导体支付2.9亿美元预付款。高塔半导体方面补充指出，客户已承诺将在2028年下达更大规模订单，并计划于2027年1月前落实后续预付款项。

　　在最新财务数据方面，受模拟及混合信号处理器市场需求驱动，高塔半导体第一季度营收同比增长15%，达到4.14亿美元，略高于预期的4.11亿美元；调整后每股收益为65美分，优于预期的56美分。展望第二季度，公司预计营收将达4.55亿美元，高于分析师平均预测的4.364亿美元。

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