Tower半导体(TSEM)签署13亿美元硅光子(SiPho)业务订单 盘前涨逾12%

金吾财讯
May 13

金吾财讯 | 高价值模拟半导体代工厂Tower Semiconductor(TSEM)周三宣布,已与其核心客户群签署了总额达13亿美元的硅光子(SiPho)业务合同,预计相关收入将于2027年集中释放。根据合同条款,Tower Semiconductor已收到客户支付的2.9亿美元产能预留预付款。公司透露,2028年的晶圆订单承诺规模将超过2027年,进一步的预付款项预计于2027年1月前到账。这些长期协议不仅巩固了公司在光连接市场的战略地位,也为其2028年实现28亿美元营收及7.5亿美元净利润的财务目标奠定了坚实基础。Tower Semiconductor首席执行官Russell Ellwanger表示,这些多年期承诺体现了客户对公司硅光子技术路线图的高度信任。随着AI基础设施建设加速,市场对高性能数据传输的需求日益迫切。公司目前正积极扩充全球多厂区产能,以支持从当前的大规模可插拔光收发器,到下一代近封装光组件(NPO)和共封装光学(CPO)解决方案的过渡。随着AI大模型对算力和带宽的需求呈指数级增长,硅光子技术已成为解决数据中心功耗与速率瓶颈的关键。Tower Semiconductor通过大规模产能预留和预付费模式,成功锁定了未来数年的增长可见性,这在半导体代工行业中具有显著的竞争优势。截至发稿,Tower Semiconductor美股盘前涨逾12%,最新报249.05美元,上涨12.78%。

Disclaimer: Investing carries risk. This is not financial advice. The above content should not be regarded as an offer, recommendation, or solicitation on acquiring or disposing of any financial products, any associated discussions, comments, or posts by author or other users should not be considered as such either. It is solely for general information purpose only, which does not consider your own investment objectives, financial situations or needs. TTM assumes no responsibility or warranty for the accuracy and completeness of the information, investors should do their own research and may seek professional advice before investing.

Most Discussed

  1. 1
     
     
     
     
  2. 2
     
     
     
     
  3. 3
     
     
     
     
  4. 4
     
     
     
     
  5. 5
     
     
     
     
  6. 6
     
     
     
     
  7. 7
     
     
     
     
  8. 8
     
     
     
     
  9. 9
     
     
     
     
  10. 10