快科技5月25日消息，据媒体报道，历经九年中美科技博弈，中国技术实现了一系列关键突破。
芯片成熟制程产能稳步爬升，集成电路产品出口额历史性突破万亿元大关；多项“卡脖子”技术正被持续攻克，芯片刻蚀、封装等领域已实现国产设备的规模化替代。
其中，中微半导体的刻蚀机已达到国际最先进的3纳米工艺水平，并成功打入全球芯片代工龙头台积电的供应链。这意味着，在全球最高端的芯片生产线上，已有了中国刻蚀设备的一席之地。
除了刻蚀机这一“拳头产品”，中微在薄膜沉积设备，尤其是LED芯片生产的关键设备MOCVD领域，也已做到全球领先。
在封装领域，长电科技、通富微电、华天科技等企业已拿下英伟达、AMD等大厂订单，稳居全球封测企业前十。
当前，中美在人工智能、先进制造、新能源、量子科技等领域均已跻身全球第一梯队，诸多议题需要双方携手应对。
以人工智能为例，中美在网络安安全、数据治理、AI伦理、跨境风险防控等方面拥有大量共同关切。
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