三星电子将从明年起正式推进面向“物理AI（Physical AI）”的半导体平台代工（Foundry）业务。预计公司将与全球电子设计自动化（EDA）及知识产权（IP）企业Cadence Design Systems合作，面向汽车、机器人、工业自动化等多种物理AI应用领域供应半导体产品。

　　据业内消息人士26日透露，三星电子与Cadence正在联合开发的“物理AI芯粒半导体平台芯片”，计划于明年年初进行流片。

　　考虑到后续量产周期最快约需6个月，因此预计明年下半年将推出该物理AI芯粒平台的实际产品。

　　此前在今年1月，三星电子与Cadence已正式宣布，将基于5纳米（nm）代工工艺合作开发基于chiplet架构的物理AI半导体平台。业内分析认为，此次合作已进一步细化了生产时间表与商业化路径。

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