三星电子称已开始向客户交付业内最先进的12层HBM4E样品，在人工智能（AI）存储芯片竞争中抢占先机。

　　这家韩国最大企业表示，这款12层HBM4E为48GB容量型，较上一代产品提升超过30%。三星今年2月启动HBM4量产，这一里程碑凸显出高带宽内存市场的开发进度之快。

　　HBM芯片通过将多层DRAM垂直堆叠，在显著提升数据传输速度的同时降低功耗，已成为AI处理器的关键组件。

　　随着AI基础设施投资快速增加，市场对速度更快、能效更高的存储芯片需求持续激增，各大内存厂商正在竞相争取未来AI系统的订单。

　　三星率先推进12层HBM4，可能有助于增强其对SK海力士等竞争对手的优势。SK海力士4月表示，目标是在2027年实现HBM4E量产，并于今年下半年向客户提供HBM4E样品。

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责任编辑：王永生

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