韩国SK集团董事长周二表示，旗下存储芯片子公司SK海力士计划在未来五年内将晶圆产能扩大一倍。

　　SK集团董事长曾在3月警告称，全球芯片晶圆短缺状况可能持续至2030年。

　　他补充道，希望SK海力士能成为英伟达Vera Rubin系统的主要高带宽内存（HBM）供应商。

　　上周，SK海力士市值首次突破1万亿美元，成为继三星电子、美光科技之后，又一家在人工智能热潮推动下达成这一里程碑的企业。

　　据Counterpoint Research数据，作为英伟达HBM芯片核心供应商，SK海力士今年第一季度占据全球HBM市场58%的份额，三星与美光各占21%。

　　SK集团董事长发表讲话之际，有分析师认为人工智能热潮正在重塑传统周期性存储芯片行业。

　　高盛将SK海力士与三星电子2028年营业利润预期分别上调24%和23.3%，至454万亿韩元（约2996.2亿美元）和610万亿韩元，理由是人工智能驱动的需求持续旺盛。

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