ASMPT(00522.HK) 宣布,已从一家领先逻辑半导体生产商获得八套用于晶粒对晶圆(C2W)应用的热压接合(TCB)工具的重复订单。该等工具将支持该集成器件制造商生产先进的客户端及数据中心中央处理器(CPU),因为在异质计算时代,为应对不断提升的性能及集成要求,基于小芯片的架构正被日益广泛采用。ASMPT集团首席执行官黄梓达称,随着先进封装要求扩展至客户端平台,这项最新成果巩固了公司在TCB...
Source LinkASMPT(00522.HK) 宣布,已从一家领先逻辑半导体生产商获得八套用于晶粒对晶圆(C2W)应用的热压接合(TCB)工具的重复订单。该等工具将支持该集成器件制造商生产先进的客户端及数据中心中央处理器(CPU),因为在异质计算时代,为应对不断提升的性能及集成要求,基于小芯片的架构正被日益广泛采用。ASMPT集团首席执行官黄梓达称,随着先进封装要求扩展至客户端平台,这项最新成果巩固了公司在TCB...
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