日月光半导体(ASX)盘前扬升2.79% 5月合并净收入增至20亿美元

金吾财讯

Jun 09

金吾财讯 | 日月光半导体(ASX)于台北时间6月9日公布了2026年5月份未经审计的合并营收报告。得益于全球人工智能及高性能计算对先进封装需求的持续井喷，公司5月业绩表现亮眼，呈现同环比双增长的强劲势头。数据表明，日月光5月合并净收入达630.33亿元新台币(约合20.01亿美元)，较今年4月的622.47亿元新台币环比微增1.3%；与2025年同期的490.27亿元新台币相比，则大幅飙升28.6%(以美元计同比增幅为26.1%)，突显出半导体行业在经历周期底部后正迎来迅猛的上升行情。作为其核心盈利支柱，日月光ATM(封装、测试与材料)业务的增长更为激进。5月份ATM业务未经审计的净收入达到421.62亿元新台币(约合13.38亿美元)，环比增长4.1%，同比涨幅则高达37.9%(以美元计同比增幅为35.2%)。市场分析人士指出，ATM核心封测业务接近四成的同比巨幅增长，直接印证了当前晶圆代工端(如台积电)先进制程产出加速释放，正向下游封测环节传导庞大的订单流。尽管公司在安全港声明中提及了行业周期性变动、地缘政治紧张局势及国际贸易政策等潜在风险，但目前在AI算力芯片供不应求的背景下，日月光凭借在先进封装领域的统治地位，其2026年全年的业绩高成长性已获强力支撑。截至发稿，ASE Technology Holding美股盘前扬升2.79%，最新报36.51美元。

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