值得一提的是,当前随着AI半导体供应链快速演进,先进封装已经成为决定芯片性能与竞争力的关键环节之一。三星电子目前正持续扩大在HBM市场的投入,希望挑战行业龙头 SK 海力士的领先地位。此前,三星电子表示,已开始向主要全球客户交付业内首批12层48GB HBM4E样品。在完成初步样品交付和优化后,三星计划根据客户的进度安排开始批量生产HBM4E。
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