当地时间6月24日，OpenAI与博通联合发布首款定制芯片Jalapeño。这是一款专用集成电路（ASIC），专为大模型推理设计，从设计到流片仅用9个月时间。合作方中，OpenAI负责架构设计，博通负责流片、网络硬件，加拿大电子制造商Celestica提供板卡/机架集成配套。该芯片通过优化数据流动，提升推理效率并降低能耗。芯片工程样片已完成实验室验证，计划2026年底规模化落地，配套千兆瓦级...
Source Link当地时间6月24日，OpenAI与博通联合发布首款定制芯片Jalapeño。这是一款专用集成电路（ASIC），专为大模型推理设计，从设计到流片仅用9个月时间。合作方中，OpenAI负责架构设计，博通负责流片、网络硬件，加拿大电子制造商Celestica提供板卡/机架集成配套。该芯片通过优化数据流动，提升推理效率并降低能耗。芯片工程样片已完成实验室验证，计划2026年底规模化落地，配套千兆瓦级...
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