应用材料公开了面向AI半导体使用的三维(3D)芯片制造设备产品线。该系列设备主要侧重于如高带宽存储器(HBM)、芯粒(C

智通财经
Jun 30
应用材料公开了面向AI半导体使用的三维(3D)芯片制造设备产品线。该系列设备主要侧重于如高带宽存储器(HBM)、芯粒(Chiplet)、混合键合(Hybrid Bonding)等先进封装工艺所需的平坦化、沉积、和计量检测等。具体来看本次公开的设备包括用于封装领域的先进化学机械抛光 (CMP)、电化学气相沉积 (ECD) 和等离子体增强化学气相沉积 (PECVD) 设备等还新增了基于电子束的工艺控制设备并升级了其用于DRAM工艺的外延设备。

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