围绕台积电CoPoS先进封装技术的市场讨论近期明显升温，中国台湾科技股亦因此进入异常投机的活跃阶段。
据台湾科技采访的多名供应链核心人士，市场对于CoPoS技术路线的解读存在重大偏差，尤其集中在玻璃基板是否为首代产品必要组件这一问题上。
受访人士均对当前泛滥的不实传言表示强烈不满。市场普遍将玻璃基板视为CoPoS不可或缺的核心材料，但首代CoPoS在技术路线上很可能并未采用玻璃基板。
同时台积电从未考虑过玻璃中介层。CoPoS预计将于2029年上半年投入量产。
三星集团旗下的三星电机（SEMCO）、日本的凸版（Toppan）以及日韩的其他基板厂商，均已加入玻璃核心基板（Glass-core substrates）的研发竞争，并于近期开始向台积电提交工程样品。
玻璃中介层位于芯片与封装基板之间，负责GPU、HBM等芯片间的高速互联。玻璃核心基板位于中介层下方，作为整个封装的承载基板，负责机械支撑以及与PCB连接。
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