路透新加坡7月3日-据周五晚间看到的一份售股文件,中国芯片设计公司上海壁仞科技6082.HK计划通过在香港配售新股筹资约8.01亿至8.38亿美元。
路透新加坡7月3日-据周五晚间看到的一份售股文件,中国芯片设计公司上海壁仞科技6082.HK计划通过在香港配售新股筹资约8.01亿至8.38亿美元。
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