快科技7月5日消息，据媒体报道，美光科技日前在日本广岛正式启动晶圆厂扩建工程。
项目总投资约1.5万亿日元（约合6303亿元人民币），用于生产高带宽存储器（HBM）等先进存储芯片，主要面向AI处理器需求，预计相关产品将于2028年夏季前后开始出货。
日本经济产业省将为该项目提供最高约5000亿日元的补贴支持。此次扩建属于美光全球AI存储产能扩张战略的重要组成部分。
美光同时也在美国爱达荷州和纽约州推进大规模先进制程投资，以全面提升DRAM与HBM的供应能力。
在项目启动仪式上，美光首席执行官桑杰·梅赫罗特拉（Sanjay Mehrotra）表示：“美光首片用于AI核心存储技术的HBM生产晶圆就在广岛制造。当美国的魄力与日本的精湛工艺相遇，你得到的不是妥协，而是世界一流的产品。”
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