Biren Technology Seeks HK$7 Billion via Share Placement
MT Newswires Live
Jul 06
Shanghai Biren Technology (HKG:6082) is looking to raise HK$7.07 billion via a share placement, according to a Hong Kong bourse filing Sunday.
The company is seeking investors for 153 million H shares priced at HK$46.20 each to raise funds to accelerate the commercialization of Biren's products.
The shares represent 6.27% of the company's issued share capital, and 5.90% as enlarged by the sale.
Disclaimer: Investing carries risk. This is not financial advice. The above content should not be regarded as an offer, recommendation, or solicitation on acquiring or disposing of any financial products, any associated discussions, comments, or posts by author or other users should not be considered as such either. It is solely for general information purpose only, which does not consider your own investment objectives, financial situations or needs. TTM assumes no responsibility or warranty for the accuracy and completeness of the information, investors should do their own research and may seek professional advice before investing.