根据TrendForce集邦咨询最新MLCC产业研究在AI Server加速换代、云端服务供应商(CSP)自研ASIC芯

智通财经
Jul 06
根据TrendForce集邦咨询最新MLCC产业研究在AI Server加速换代、云端服务供应商(CSP)自研ASIC芯片持续放量的双重驱动下Murata(村田)、Samsung Electro-Mechanics(三星电机)、Taiyo Yuden(太阳诱电)等三大龙头厂商2026年6月下旬BB Ratio(订单出货比)分别达1.30、1.31、1.25创新高整体MLCC市场BB Ratio也同步升至1.04。观察2026年下半年MLCC市况随着NVIDIA(英伟达)、Google、AMD等新款AI芯片平台于第三季陆续进入量产产能持续由AI订单占用再加上超前备货等双重需求下半年交期延长、高端MLCC价格走扬概率上升预计第四季将是观察高端MLCC市场是否正式转向缺货的关键期。

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