【基本半导体在港交所主板挂牌上市】7月8日，基本半导体在香港联合交易所主板挂牌上市。公司创始人、董事长汪之涵博士在上市致辞中表示，碳化硅正迎来AI算力、材料革命、先进封装三重风口叠加；依托香港国际金融中心和联通世界的独特优势，公司致力成为具有全球影响力的半导体企业。据弗若斯特沙利文统计，按2024年收入计，基本半导体在中国碳化硅功率模块市场排名第六，在中国公司中排名第三。
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