【晶合集成：2.16亿股H股于7月10日在港交所挂牌上市】晶合集成公告称，公司本次全球发售H股总数2.16亿股，其中香港公开发售占10%，国际发售占90%。按每股发售价32.30港元计算，扣除相关费用后，假设超额配售权未行使，所得款项净额约67.79亿港元。2026年7月10日，该等H股在香港联交所主板挂牌并上市交易。本次发行上市前，公司总股本为20.08亿股。发行后，若超额配售权未行使，总股本为22.24亿股；若悉数行使，则为22.56亿股。持股5%以上股东持股比例相应稀释。
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