智通财经APP获悉，晶合集成(02249)首挂上市，公告显示，每股定价32.3港元，共发行2.16亿股股份，每手100股，所得款项净额约67.79亿港元。截至发稿，涨11.46%，报36港元，成交额7.55亿港元。
招股书显示，晶合集成是一家领先的12英寸纯晶圆代工企业，处于全球半导体价值链的关键环节。作为专业的晶圆代工服务供应商，代工企业将无晶圆、轻晶圆及垂直整合制造(IDM)公司的集成电路设计蓝图大规模地制成高品质的加工晶圆。
晶合集成将差异化制程技术与稳定制造规模结合的能力，巩固公司于全球晶圆代工领域的地位。根据弗若斯特沙利文的资料，于2020年至2025年，全球前十大晶圆代工企业中，公司的产能及收入增长速度为全球第一。根据同一资料来源，于2025年，以收入计，公司为全球第九大、中国大陆第三大晶圆代工企业。
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