博通与力成将设立面板级先进封装合资公司

智通财经
Jul 16
【博通与力成将设立面板级先进封装合资公司】封测大厂力成今日宣布,将与博通于新加坡共同设立面板级先进封装制造合资公司,预计投资总额4亿美元,将视新加坡设厂进度及资金需求逐步投入。成立合资公司的主要目的在于配合整体国际布局策略,并贴近全球客户供应链需求,强化先进封装制造能力。

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