机构:AI竞争从芯片转向基建 电力、光通信、量子计算成核心卡点

智通财经
Jul 20
【机构:AI竞争从芯片转向基建 电力、光通信、量子计算成核心卡点】K-ASIC在近期发布的《2026上半年美国半导体产业动向》报告中强调:“半导体产业的竞争重心已从个别芯片性能转向AI基础设施。” K-ASIC是2024年9月由韩国产业通商资源部牵头在美国加利福尼亚州圣何塞设立的韩国系统半导体产业支援基地。K-ASIC基于上半年分析指出:“英伟达、AMD、博通等半导体无晶圆厂企业正在超越GPU和定制半导体,展开集成化系统平台竞争”,“谷歌、亚马逊、Meta、微软等超大规模企业正致力于构建包含自研芯片、数据中心、电力资产在内的垂直整合型AI平台。” 换言之,竞争已从“AI半导体芯片能多快、执行多少运算”转向了“先发制人抢占内存、电力、网络、数据中心等AI基础设施整体”的格局。 K-ASIC方面评估认为,AI基础设施建设存在三大瓶颈,分别是: 电力——决定AI数据中心扩展上限; 光通信——连接数万个AI半导体加速器; 量子计算——正作为下一代计算范式崛起。

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