半导体扩产遇瓶颈:设备交期大幅拉长 韩国存储巨头考虑提前下单

格隆汇
Jul 24

据科创板日报,近期半导体设备五大供应商(应用材料、阿斯麦、泛林、东京电子及科磊)的主要设备交付周期已延长至原来的1.5倍至2倍。具体交期因设备对应的工艺环节而有所不同,但之前正常情况下交期6个月的设备,目前下单后需要等待一年左右才能收到。 除了上述几家全球龙头厂商之外,韩国本土主要设备厂的交期也在拉长。一位半导体设备行业高管表示,“即使是那些已经提前预留了产能的设备厂,如今交期也在延长,产线已经满负荷运转;至于那些没能提前扩产的企业,面对大量涌入的订单,更是经常有交付延迟的情况。” \如果设备无法按时到位,势必也将影响半导体厂商的新厂投产。因此,三星及SK海力士的采购部门正密切监测设备交付情况,并开始研究相关应对措施。业内人士透露,由于设备交期不断拉长,这两家巨头正计划提前下达采购订单。

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