金吾财讯 | 根据全球半导体行业协会（SEMI）发布的报告，2026年全球半导体设备销售额预计将增长23.2%，达到1659亿美元，到2028年将创下历史新高，达到2295亿美元。SEMI代表全球约3000家电子设计和制造企业。该协会表示，人工智能基础设施的扩展以及对先进逻辑芯片和下一代存储产品（包括高带宽内存HBM）的投资，将推动市场增长。晶圆制造设备市场规模到2028年预计将达到2000亿美元，这得益于人工智能相关生产能力的扩大以及向先进制造工艺的转型。内存设备投资也预计将显著增长，这主要得益于对HBM（高带宽内存）需求的上升，以及向先进动态随机存取存储器（DRAM）和NAND闪存产品转型。2028年，全球DRAM和NAND设备的销售额预计将分别达到569亿美元和208亿美元。
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