Wingtech Technology (SHA:600745) on July 28 will pay the fifth-year interest of 1.80 yuan per bond, covering the period through July 27.
The record date is set for July 27, according to a Wednesday filing with the Shanghai bourse.
The 8.6-billion-yuan bond issue, listed in August 2021 with a 2.00% final-year coupon.
Shares of the chipmaker were down 5% in recent trade.
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