无凸块的混合键合相较现有键合方案可缩短上下层器件间的垂直距离，从而改善性能与功耗表现。业内人士预计，混合键合的大规模商用化将等到 2029~2030 年，届时传统技术已无法满足 NVIDIA Feynman 等新一代 AI XPU 的要求。
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