Shanghai Junshi Biosciences (HKG:1877, SHA:688180) completed the issuance of its 2026 second tranche of technology innovation bonds and received the proceeds on Tuesday, according to a Wednesday Hong Kong bourse filing.
The company issued the three-year bonds with a total principal amount of 300 million yuan at an interest rate of 2.59%.
The bonds will mature on July 22, 2029, the filing showed.
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