Inspur Electronic Information Industry (SHE:000977) issued 1 billion yuan of five-year bonds, according to a Saturday filing with the Shenzhen bourse.
The bonds hold a coupon rate of 1.85% and will mature July 24, 2031.
Shanghai Pudong Development Bank (SHA:600000) is the bookkeeping manager and lead underwriter for this issuance, while Industrial Bank (SHA:601166) is the joint lead underwriter.
Inspur's shares slipped 2% during the midday break on Monday.
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