【芯和半导体联合联想DAC 2026发布EDA Agent落地成果】7月28日，芯和半导体在DAC 2026大会现场联合联想集团发布EDA Agent最新成果。该技术打通了PCB研发从设计到仿真验证的全流程AI设计闭环，目前该成果已在联想AI PC主板PCB的设计与仿真中完成验证。据其提供的数据显示，在设计环节，其实现原理图符号、PCB封装自动化建库效率提升50%以上；在仿真环节，SERDES全链路优化仿真寻优效率提升80%以上。
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