摩根士丹利:谷歌 Frozen v2 芯片无需台积电 CoWoS 封装,采用片上 SRAM

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【摩根士丹利:谷歌 Frozen v2 芯片无需台积电 CoWoS 封装,采用片上 SRAM】摩根士丹利最新研报指出,谷歌自研 Frozen v2 芯片可能不会采用台积电的 CoWoS 高级封装技术,计划把 SRAM 直接集成到芯片硅片上。在封装技术方面,目前行业观点认为台积电的 CoWoS 封装更适合高性能 AI 芯片,而英特尔的 EMIB-T 被普遍认为更适合中高端 AI 芯片,不过最新研报称谷歌可能放弃封装,把 SRAM直接集成到芯片硅片中。这种方案的优势是具备极高带宽和超低延迟,但同时也面临裸片面积增大、功耗与散热升高的巨大挑战。

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