IT之家 7 月 28 日消息，工商时报昨日（7 月 27 日）发布博文，报道称台积电位于美国亚利桑那州的 Fab 21 工厂下线英伟达首批美国制造的 GB300 GPU，不过依然需要运输到台积电其它工厂完成后续的封装。
IT之家援引博文介绍，台积电 Fab 21 工厂采用 4nm 工艺，制造了首批 NVIDIA GB300 AI GPU。不过该工厂暂无高端封装能力，在后续的 CoWoS 封装环节，依然需要运输到其它台积电工厂处理。
图源：台积电
台积电目前正推进美国芯片封装落地，计划投资 2650 亿美元在亚利桑那州建设两座先进封装工厂，从而形成一个完整的制造集群，补齐美国生产芯片的最后一块拼图。
一旦台积电的 CoWoS 和 SoIC 封装工厂投产，它将能够在美国境内完成 NVIDIA Blackwell 和 Rubin 芯片的全部生产流程。台积电还计划在 2028 年前将 N2（2nm）和 A16（1.6nm）工艺迁到美国本土生产。
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