科技媒体 Wccftech 昨日（7 月 24 日）发布博文，报道称英特尔代工业务（Intel Foundry）有望和英伟达达成合作，为英伟达 Feynman GPU 提供晶圆与先进封装支持，相关量产时间点指向 2028 年。
IT之家援引博文介绍，在最新财报电话会议上，英特尔首席执行官陈立武表示，公司增加资本开支，覆盖先进封装与晶圆厂建设，并称这反映出对各业务单元客户需求的信心。
陈立武同时表示，前端晶圆厂成本高于封装设施，因此新增投入会更偏向前端产能。他还提到，公司已在若干领域获得长期协议，可据此预测未来几年需求。
该媒体报道称陈立武所述目标产品为英伟达 Feynman GPU，时间定位在 Rubin 之后。Wccftech 给出的路线图显示，Feynman 预计于 2028 年发布，可能搭配 Rosa CPU、HBM5 内存，并可能采用 Intel 14A 或 TSMC A14 级工艺。
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