JHT Design Plans 850 Million Yuan Convertible Bond Sale to Fund Semiconductor Expansion
MT Newswires Live
Jul 31
JHT Design (SHA:603061) plans to issue up to 850 million yuan in convertible bonds to unspecified investors to fund its semiconductor equipment plant expansion, according to a Shanghai bourse filing on Friday.
The manufacturer of semiconductor chip testing equipment said the proposed convertible bonds have received an AA credit rating with a stable outlook from China Chengxin International Credit Rating.
A portion of the proceeds will be used to support the construction of its smart manufacturing and R&D facility for advanced semiconductor equipment.
JHT's shares jumped 8% in late-afternoon trade Friday.
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