据The Information报道两位直接了解该项目的人士透露台积电(TSM.US)正在开发一种与英特尔(INTC.U

智通财经
Jul 30
据The Information报道两位直接了解该项目的人士透露台积电(TSM.US)正在开发一种与英特尔(INTC.US)现有技术类似的先进芯片封装技术。过去封装一直被视为半导体制造中相对常规的工序但随着AI需求激增芯片设计公司需要将更多处理器和高带宽内存集成到越来越庞大、复杂的封装中先进封装已成为行业最关键的瓶颈之一。英特尔开发了一种名为嵌入式多芯片互连桥(EMIB)的封装技术。该技术利用小块硅桥在处理器与内存之间建立高速连接由于能够支持更大规模的多芯片设计从而打造性能更强的AI芯片并帮助芯片设计商实现供应链多元化因此吸引了英伟达(NVDA.US)等潜在客户的关注。知情人士表示在台积电内部工程师将这一先进封装项目称为“类EMIB”并已与部分客户讨论过这一方案。

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