【先进封装行业迎来扩产潮 7只概念股获机构高频调研】随着全球先进封装产能持续紧缺，国内封测行业迎来大规模扩产潮，长电科技、华天科技、深科技、通富微电、盛合晶微等龙头企业纷纷扩大先进封装产能，重点布局高端存储、功率半导体、高性能计算封装赛道。同时，产业链将进一步提升生态协同水平，加速国产先进封装自主可控进程。从市场前景来看，据市场研究机构Yole预估，2025年全球先进封装的市场规模为540亿美元，预计到2031年将增至1090亿美元。据数据宝统计，截至目前，今年以来机构调研5次及以上的先进封装概念股有7只，包括鼎龙股份、通富微电、气派科技、唯特偶、精智达、蓝箭电子、金海通等。鼎龙股份年内累计获机构调研20次，调研频次居首。公司最近1次接受机构调研时表示，公司累计布局四十余款高端晶圆光刻胶产品，多款型号持续在国内头部晶圆厂开展验证测试；目前已有8款ArF、KrF光刻胶实现稳定批量供货，并持续拓展新增客户订单。半导体封装PI材料已布局7款产品，其中2款获得多家客户订单。
Disclaimer: Investing carries risk. This is not financial advice. The above content should not be regarded as an offer, recommendation, or solicitation on acquiring or disposing of any financial products, any associated discussions, comments, or posts by author or other users should not be considered as such either. It is solely for general information purpose only, which does not consider your own investment objectives, financial situations or needs. TTM assumes no responsibility or warranty for the accuracy and completeness of the information, investors should do their own research and may seek professional advice before investing.