联发科确认导入英特尔EMIB-T用于ASIC封装

格隆汇
Aug 03
据科创板日报,联发科于最新法说会中确认,在AI ASIC专案中,除采用台积电CoWoS封装外,也同步导入英特尔EMIB-T先进封装技术,代表公司封装策略朝向多元化发展,以应对不同客户的大型AI芯片设计需求。

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