8月10日，据《华尔街日报》消息，受人工智能投资热潮引发的“芯片通胀（Chipflation）”成本压力影响，苹果将目光投向国产存储半导体。对此，财闻致电长鑫科技证券部，相关人士回应称：公司对外所有重大合作、产能进度等信息，以公司公告、招股书、以及后续的中期报告为主；至于DDR6产能规划、量产进度等，出于信息合规管理要求，暂不方便对外透露。关于市场传闻等，公司将会严格遵照上市信息披露规则，结合实际情况推进相关信披工作。（财闻）。
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