新平台让AI芯片更紧凑、高速且节能

格隆汇
Aug 14
日本东京科学大学研究团队开发出一种面向人工智能(AI)系统的新型半导体集成平台BBCube。该平台融合高密度芯片贴装、无凸点芯片互连和多尺度热分析三项技术,可提高AI芯片集成密度和数据传输能力,同时降低热阻、改善散热性能,为高性能、低能耗AI加速器和高性能计算系统提供了新的技术方案。相关成果已在美国举行的2026年第76届IEEE电子元件与技术大会以及2026年IEEE/JSAP超大规模集成电路技术与电路研讨会上公布。

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